YG104-ICH Datasheet, PDF (9/13 Pages) Seoul Semiconductor – Surface-mounted chip LED device

7. Outline Dimension
0.18
Resin
PCB
0.8
0.4 ^{± 0.05}
㎜ Tolerance ± 0.1, Unit :
Polarity Mark
Cathode
Anode
0.8
[Recommended Solder Pattern]
8. Material
Item
Material
Substrate
BT-Resin PCB
chip
AlInGaP
wire
Gold
Encapsulate Electrode
Epoxy
Au Plated
Rev. 01
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)