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YG104-ICH Datasheet, PDF (10/13 Pages) Seoul Semiconductor – Surface-mounted chip LED device
9. Reel Structure
1.5
+0.1
-0
4.0 ± 0.1
2.0 ± 0.05
0.2 ± 0.05
4.0 ± 0.1
0.5 ± 0.08
0.95 ± 0.05
180
+0
-3
0.5 ± 0.05
11.4
9 ± 0.3
13 ± 0.2
2 ± 0.2
22
Label
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm
℃ (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10 angle to be the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a
damp proof Package
Rev. 01
January 2012
WWW.SEOULSEMICON.COM
서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0)