FR2001H-T Datasheet, PDF (5/11 Pages) Seoul Semiconductor – Surface-mounted chip LED device

3.Outline Dimension
( Tolerance: ±0.1, Unit: mm )
[TOP VIEW]
[SIDE VIEW]
[BOTTOM VIEW]
- Recommended Soldering Design
[INNER CIRCUIT]
* MATERIALS
PARTS
Package
Encapsulating Resin
Electrodes
MATERIALS
Lead Frame
Epoxy Resin
Au Plating Copper Alloy
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)