FR2001H-T Datasheet, PDF (10/11 Pages) Seoul Semiconductor – Surface-mounted chip LED device

6. Soldering
(1) Lead Solder
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
240℃ Max.
Soldering time
Condition
10 sec. Max.
2.5~5 C / sec.
Lead Solder
2.5~5o C / sec.
240 ^oC Max.
10 sec. Max.
1P2r0e~-h1e5a0toinCg
6A0bsoevc.eM20a0xo.C
120sec. Max.
(2) Lead-Free Solder
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
260℃ Max.
Soldering time
Condition
10 sec. Max.
1~5 ^oC / sec.
Lead-frame Solder
1~5 ^oC / sec.
260 ^oC Max.
10 sec. Max.
1P5r0e~-h2e0a0tionCg
6A0bsoevc.eM22a0xo.C
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)