AM101-DP Datasheet, PDF (5/13 Pages) Seoul Semiconductor – Surface-mounted chip LED device

3.Outline Dimension
0.28
Polarity Mark
0.8
Top view
PCB
0.8
Side view
Bottom view
( Tolerance: ±0.1, Unit: mm )
0.8
[Recommended Solder Pattern]
* MATERIALS
PARTS
Package
Encapsulating Resin
Electrodes
MATERIALS
BT Resin
Epoxy Resin
Au Plating Copper Alloy
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)