EWT801-S Datasheet, PDF (15/21 Pages) Seoul Semiconductor – Package: White PLCC2 White Color Technology: InGan/Gan

APCPCWM_4828539:WP_0000001WP_0000001
7. Package Dimension
2.80
2.20
1.9
0.85
Anode
C0.8
Cathode mark (-)
0.50 _0.15
Cathode
R ecom m ended
Solder Pad
Paddesign for
improved heat dissipation
+
Cu-area > 16mm²
-
Heat pad
Solder resist
8. Material
item
Material
Chip
InGaN
Package
Heat-Resistant
Polymer
Encapsulate
Silicone Resin
+ Phosphor
Electrodes
Ag Plating
Copper Alloy
EWT801-S
15/ 21
Rev. 04
29. November. 2011
www.seoulsemicon.com