HB1701 Datasheet, PDF (11/12 Pages) Seoul Semiconductor – 2.1*0.6*0.88 mm Inner Lens type Wavelength: 465 nm

9 . Soldering
(1) Lead Solder
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
240℃ Max.
Soldering time
Condition
10 sec. Max.
2.5~5 C / sec.
Lead Solder
2.5~5o C / sec.
240 ^oC Max.
10 sec. Max.
Pre-heating
120~150 ^oC
60sec. Max.
Above 200 ^oC
120sec. Max.
(2) Lead-Free Solder
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
260℃ Max.
Soldering time
Condition
10 sec. Max.
1~5 ^oC / sec.
Lead-frame Solder
1~5 ^oC / sec.
260 ^oC Max.
10 sec. Max.
Pre-heating
150~200 ^oC
60sec. Max.
Above 220 ^oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev.02
December 2010
www.seoulsemicon.com
Document No. : SSC-QP-7-07-24 (Rev.00)