50162801 Datasheet, PDF (8/8 Pages) Sensortechnics GmbH – High energy physics

Near Ultraviolet (NUV) SiPMs
Reflow soldering profile ⁽¹⁰⁾
Time [s]
Specification notes
(10) The reflow soldering must be performed within 24 hours once the device has
been removed from package and stored in a 25 °C and <60 % RH ambient
conditions. The reflow soldering profile is recommended for Pb-free solder such
as Tin-Silver-Copper (SAC). The peak temperature must not exceed 250 °C.
Ordering information
Order #
50162801
50162802
50162803
50162804
Series
SiPM-
Range
NUV [Near Ultraviolet]
Active area
1S
(1x1) mm² square
1C
Ø 1.2 mm circular
3S
(3x3) mm² square
4S
(4x4) mm² square
Housing
-SMD [Plastic chip scale package (CSP)]
Version 29-07-15
Subject to change without notice
www.first-sensor.com
[e-mail]
Page 8/8