GS2960A Datasheet, PDF (98/99 Pages) Gennum Corporation – Ancillary data extraction

7.4 Solder Reflow Profiles
The GS2960A is available in a Pb-free package. It is recommended that the Pb-free
package be soldered with Pb-free paste using the reflow profile shown in Figure 7-1.
Temperature
260°C
250°C
217°C
200°C
3°C/sec max
60-150 sec.
20-40 sec.
6°C/sec max
150°C
25°C
60-180 sec. max
8 min. max
Figure 7-1: Pb-free Solder Reflow Profile
7.5 Ordering Information
Part Number
GS2960AIBE3
GS2960AIBTE3
Package
100-ball BGA
100-ball BGA
(250pc tape & reel)
Pb-free
Yes
Yes
Time
Temperature Range
-20°C to 85°C
-20°C to 85°C
Revision History
Version ECR PCN
2
158468 –
1
155217 –
0
153769 –
Date
September 2012
October 2010
May 2010
Changes and/or Modifications
Changes throughout the document.
Change pin D7 name to SW_EN in the Functional Block Diagram and Pin
Assignment sections. Corrected Package Dimensions and updated Ordering
Information.
New document.
GS2960A 3Gb/s, HD, SD SDI Receiver
Data Sheet
54384 - 2
September 2012
98 of 99