GS6081 Datasheet, PDF (17/19 Pages) Semtech Corporation – Input signal trace equalizationnull

6.4 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. MSL qualification was performed
using the maximum Pb-free reflow profile shown in Figure 6-3.
Temperature
260°C
250°C
217°C
200°C
3°C/sec max
60-150 sec.
20-40 sec.
6°C/sec max
150°C
25°C
60-180 sec. max
8 min. max
Time
Figure 6-3: Maximum Pb-free Solder Reflow Profile
6.5 Marking Diagram
Pin 1
Indicator
GS6081
XXXXE3
YYWW
Figure 6-4: Marking Diagram
XXXX - Last 4 digits (excluding decimal)
of SAP Batch Assembly (FIN) as listed on
Packing Slip.
E3 - Pb-free & Green indicator
YYWW - Date Code
GS6081
Final Data Sheet
PDS-060046
Rev.4
July 2014
www.semtech.com
17 of 19
Proprietary & Confidential