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HFP2N65 Datasheet, PDF (2/7 Pages) SemiHow Co.,Ltd. – 650V N-Channel MOSFET
Electrical Characteristics TC=25 °C unless otherwise specified
Symbol
Parameter
Test Conditions
Min
On Characteristics
VGS Gate Threshold Voltage
VDS = VGS, ID = 250 ㎂
2.5
RDS(ON) Static Drain-Source
On-Resistance
VGS = 10 V, ID = 0.9 A
--
Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 ㎂
650
ΔBVDSS Breakdown Voltage Temperature
/ΔTJ Coefficient
ID = 250 ㎂, Referenced to25℃
--
IDSS Zero Gate Voltage Drain Current VDS = 650 V, VGS = 0 V
--
VDS = 520 V, TC = 125℃
--
IGSSF Gate-Body Leakage Current,
Forward
VGS = 30 V, VDS = 0 V
--
IGSSR Gate-Body Leakage Current,
Reverse
VGS = -30 V, VDS = 0 V
--
Dynamic Characteristics
Ciss Input Capacitance
--
Coss Output Capacitance
VDS = 25 V, VGS = 0 V,
--
f = 1.0 MHz
Crss Reverse Transfer Capacitance
--
Switching Characteristics
td(on) Turn-On Time
tr Turn-On Rise Time
td(off) Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg Total Gate Charge
Qgs Gate-Source Charge
Qgd Gate-Drain Charge
VDS = 325 V, ID = 1.8 A,
--
RG = 25 Ω
--
--
(Note 4,5)
--
VDS = 520V, ID = 1.8 A,
--
VGS = 10 V
--
(Note 4,5)
--
Source-Drain Diode Maximum Ratings and Characteristics
IS Continuous Source-Drain Diode Forward Current
--
ISM Pulsed Source-Drain Diode Forward Current
--
VSD Source-Drain Diode Forward Voltage IS = 1.8 A, VGS = 0 V
--
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
IS = 1.8 A, VGS = 0 V
--
diF/dt = 100 A/μs (Note 4)
--
Typ Max Units
--
4.5
V
4.5 6.0
Ω
--
--
V
0.65 -- V/℃
--
1
㎂
--
10
㎂
-- 100 ㎁
-- -100 ㎁
330 430 ㎊
40
50
㎊
8 10.5 ㎊
15
30
㎱
40
80
㎱
40
80
㎱
30
60
㎱
9.0 11.5 nC
1.9
--
nC
3.8
--
nC
-- 1.8
A
-- 7.2
--
1.4
V
220 --
㎱
1.1
--
μC
Notes ;
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L=68mH, IAS=1.8A, VDD=50V, RG=25Ω, Starting TJ =25°C
3. ISD≤1.8A, di/dt≤300A/μs, VDD≤BVDSS , Starting TJ =25 °C
4. Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature
◎ SEMIHOW REV.A0,July 2007