LC9998G Datasheet, PDF (10/11 Pages) Sanyo Semicon Device – 1/5 Optical Size PAL Color Solid-State Image Sensor

LC9998G
Notes on Mounting and Handling
1. Preventing Electrostatic Discharge (ESD)
Since CCD sensors are easily destroyed by ESD, the antistatic measures described below should be employed when
handling this device.
• All tools and personnel must be grounded when handling CCDs. Note that a 1 MΩ resistor should be inserted in
series between personnel and ground for safety. (We recommend using wrist straps for personnel grounding.)
• Personnel should handle CCD devices with either bare hands or antistatic gloves. Use antistatic materials for work
garments. Personnel should wear conductive shoes.
• Lay conductive mats on the floor and benches in the workplace so that static charges do not accumulate.
• We recommend using ionized air blowers (or other static removal techniques) when handling CCD sensors.
• Use antistatic boxes when transporting boards that have CCD sensors mounted on them.
• Do not leave packing materials or fittings made from plastic materials (such as Styrofoam) that easily collect static
charges on or near workplace tables.
• Ground all tools, test equipment, conveyors, soldering irons, and other objects used in the workplace. Inspect
grounding regularly to assure that it is complete.
• Do not handle this IC in the vicinity of TV monitors or other equipment that generates high static voltages. If
unavoidable, install antistatic filters in front of monitor screens and take all other possible antistatic measures.
• Static charges accumulate easily in workplaces with a low relative humidity. Manufacturing operations should be
carried out in an environment with a relative humidity of at least 50%.
2. Soldering
• The CCD package temperature must not exceed 80°C.
• Since CCD sensors are sensitive to thermal stress as well as ESD, the soldering iron temperature should be under
300°C. Aim for a soldering time of 2 seconds per pin.
• Use soldering irons that include an adjustable temperature control function that holds the soldering iron tip at a
constant temperature.
• Be especially careful to assure that the device package temperature does not exceed 80°C when repairing or
redoing solder joints or when removing CCD sensors from printed circuit boards.
3. Soiling and Contamination Prevention
• CCD sensors should be handled in a clean workplace. (A class 1000 level is appropriate.)
• Do not touch the package surface and do not allow any object to contact the package surface. Use compressed air
to remove any foreign objects (such as dust) that land on the package surface. (We recommend using an ionized air
blower if possible.)
• Use a cotton swab dipped in ethyl alcohol to remove oily contamination, being especially careful not to scratch the
package surface.
• Use special-purpose cases to prevent soiling and contamination. Warm or cool CCD sensors in advance to prevent
condensation when transporting between rooms with radically differing temperatures.
• For CCD sensors that are shipped with protective tape applied, only remove that tape immediately prior to use in
an environment in which ESD prevention measures have been fully implemented. Do not reuse protective tape that
has been removed from a CCD sensor.
No.5219-10/11