QTE Datasheet, PDF (6/8 Pages) Samtec, Inc – 0,80 mm (.0315”) Q Strip® High Speed Ground Plane Socket / Terminal Strips

Product Specification
Series: QSE / QTE 0,80 mm (.0315”) Q Strip^® High Speed Ground Plane Socket / Terminal Strips
7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec
does not specify a recommended reflow profile for our connectors. The processing parameters provided by the
solder paste manufacturer should be employed and can usually be found on their website.
All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile
parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak
temperature of 260°C as well as 30 seconds above 255°C.
Due to their weight and/or offset center of gravity, right angle (-RA) components cannot be run through the reflow
oven while inverted.
Samtec Recommended Temperature Profile Ranges (SMT)
Sn-Pb Eutectic Assembly
Preheat/Soak
(100°C-150°C)
Max Ramp Up
Rate
Reflow Time
(above 183°C)
60-120 sec.
3°C/s max.
40-150 sec.
Peak
Temp
235°C
Time within 5°C
of 235°C
20 sec. max.
Max Ramp
Down Rate
6°C/s max.
Time 25°C to
Peak Temp
6 min. max.
Pb-Free Assembly
Preheat/Soak
(150°C-200°C)
Max Ramp Up Reflow Time
Rate
(above 217°C)
60-120 sec.
3°C/s max.
40-150 sec.
Peak
Temp
260°C
Time within 5°C
of 260°C
30 sec. max.
Max Ramp
Down Rate
6°C/s max.
Time 25°C to
Peak Temp
8 min. max.
7.3.1
These guidelines should not be considered design requirements for all applications.
Samtec recommends testing interconnects on your boards in your process to guarantee optimum results.
7.4 Maximum Reflow Passes: Parts can withstand three reflow passes at a peak component temperature of 260°C.
Revision: C
Date: November 11, 2015
Page 6
© Samtec, Inc.