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K4T51083QC Datasheet, PDF (27/29 Pages) Samsung semiconductor – 512Mb C-die DDR2 SDRAM
512Mb C-die DDR2 SDRAM
DDR2 SDRAM
VOH + x mV
VOH + 2x mV
tHZ
tRPST end point
T2
T1
VOL + 2x mV
VOL + x mV
tHZ,tRPST end point = 2*T1-T2
VTT + 2x mV
VTT + x mV
tLZ
tRPRE begin point
VTT - x mV
VTT - 2x mV
T1
T2
tLZ,tRPRE begin point = 2*T1-T2
<Test method for tLZ, tHZ, tRPRE and tRPST>
29. Input waveform timing with differential data strobe enabled MR[bit10]=0, is referenced from the input signal crossing at the VIH(ac) level to the differen-
tial data strobe crosspoint for a rising signal, and from the input signal crossing at the VIL(ac) level to the differential data strobe crosspoint for a falling sig-
nal applied to the device under test.
30. Input waveform timing with differential data strobe enabled MR[bit10]=0, is referenced from the input signal crossing at the VIH(dc) level to the differen-
tial data strobe crosspoint for a rising signal and VIL(dc) to the differential data strobe crosspoint for a falling signal applied to the device under test.
Differential Input waveform timing
DQS
DQS
tDS tDH
tDS tDH
VDDQ
VIH(ac) min
VIH(dc) min
VREF(dc)
VIL(dc) max
VIL(ac) max
VSS
Page 27 of 29
Rev. 1.4 Aug. 2005