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DS_K7A803600B Datasheet, PDF (16/18 Pages) Samsung semiconductor – 256Kx36 & 512Kx18 Synchronous SRAM
K7A803600B
K7A801800B
256Kx36 & 512Kx18 Synchronous SRAM
APPLICATION INFORMATION
DEPTH EXPANSION
The Samsung 256Kx36 Synchronous Pipelined Burst SRAM has two additional chip selects for simple depth expansion.
This permits easy secondary cache upgrades from 256K depth to 512K depth without extra logic.
Data
Address
A[0:18]
A[18]
A[0:17]
I/O[0:71]
A[18]
A[0:17]
CLK
Microprocessor
Address
CLK
Cache
Controller
Address Data
CS2
CS2
CLK
ADSC
WEx
OE
256Kx36
SPB
SRAM
(Bank 0)
CS1
ADV ADSP
Address Data
CS2
CS2
CLK
ADSC
WEx
OE
256Kx36
SPB
SRAM
(Bank 1)
CS1
ADV ADSP
ADS
INTERLEAVE READ TIMING (Refer to non-interleave write timing for interleave write timing)
(ADSP CONTROLLED , ADSC=HIGH)
Clock
ADSP
tSS
tSH
ADDRESS A1
[0:n]
tWS
tWH
WRITE
tAS
tAH
A2
CS1
An+1
ADV
tCSS
tCSH
Bank 0 is selected by CS2, and Bank 1 deselected by CS2
tADVS
tADVH
Bank 0 is deselected by CS2, and Bank 1 selected by CS2
OE
Data Out
(Bank 0)
tOE
tLZOE
Q1-1
Q1-2
Q1-3
Data Out
(Bank 1)
*Notes : n = 14 32K depth , 15 64K depth
16 128K depth , 17 256K depth
18 512K depth
tHZC
Q1-4
tCD
tLZC
Q2-1 Q2-2 Q2-3 Q2-4
Don′t Care Undefined
- 16 -
Nov. 2003
Rev 3.0