SP3900 Datasheet, PDF (6/7 Pages) SamHop Microelectronics Corp. – Super high dense cell design for low RDS(ON).

SP3900
PACKAGE OUTLINE DIMENSIONS
DFN 3x3-8L
E
E1
E2
L
Ver 1.1
b
D
D2
D3 ^D1
e
L1
TOP VIEW
A
E3
BOTTOM VIEW
A1 ^c
SYMBOLS
A
A1
b
c
D
D1
D2
D3
E
E1
E2
E3
e
L
L1
0
SIDE VIEW
MIN
0.70
0.00
0.24
0.10
0.30
0.00
0^o
MILLIMETERS
NOM
0.80
0.30
0.152
3.00 BSC
2.475 BSC
1.063 BSC
0.225 BSC
3.20 BSC
3.00 BSC
1.813 BSC
0.525 BSC
0.65 BSC
0.40
10^o
MAX
0.90
0.05
0.35
0.25
0.50
0.100
12^o
6
Jan,23,2014
www.samhop.com.tw