TCFG_C Datasheet, PDF (8/12 Pages) Rohm – Chip tantalum capacitors with (Fail-safe open structure type)

Tantalum capacitors
TCFG series C Case
Malfunction rate as function of operating
temperature and rated voltage
1.0 _{Ratio = Applied Voltage}
Rated Voltage
1.0
0.5
0.3
0.2
0.7
0.1
0.5
0.06
0.03
0.02
0.3
0.01
20
0.1
40
60
85
OPERATING TEMPERATURE ( C)
Fig.3
(4) External temperature vs. fuse blowout
360
350
340
330
320
310
300
290
280
270
260
1
half failed
failed
no failed
C case
D case
10
100
OPERATING TIME (sec)
Fig.5
Malfunction rate as function of circuit resistance (:/V)
6.0
4.0
2.0
1.0
0.8
0.6
0.4
0.1 0.2 0.4 0.6 1.0 2.0 3.0
RESISTANCE OF CIRCUIT (Ω / V)
Fig.4
(5) Power vs. fuse blowout characteristics / Product
surface temperature
100
90
80
70
C case ³⁵⁰
D case ₃₂₅
surface temp.
300
curve of the products ( C)
275
60
250
50
operating time (s)
40
225
200
30
175
20
150
10
125
0
100
0 1 2 3 4 5 6 7 8 9 10
ELECTRIC POWER (W)
Fig.6
Note: Solder the chip at 300qC or less. If it is soldered using
a temperature higher than 300qC, open function built-in may operate.
(6) Maximum power dissipation
Warming of the capacitor due to ripple voltage balances with warming caused by Joule heating and by radiated heat.
Maximum allowable warming of the capacitor is to 5qC above ambient temperature. When warming exceeds 5qC, it can
damage the dielectric and cause a short circuit.
Power dissipation (P) = I²Â¦R
Ripple current
P : As shown in table at right
R : Equivalent series resistance
Notes:
1. Please be aware that when case size is changed, maximum allowable power dissipation is reduced.
2. Maximum power dissipation varies depending on the package. Be sure to use a case which will keep warming within
the limits shown in the table below.
Rev.C
8/11