BDXXFA1FP3 Datasheet, PDF (8/17 Pages) Rohm – High accuracy output voltage

BDxxFA1FP3
●Power Dissipation
◎SOT89-3K
2
1.67W
1.5
θj‐a = 74.8℃/W
1
0.5
0
0 25 50 75 100 125 150
Ambie_周nt_囲Te_温mp_度ea_:r_Ttu_ar_[e_℃: _]Ta [°C]
Measurement condition: mounted on 4-layer JEDEC standard board
Board size: 114.3mm × 76.2mm × 1.6mm
Datasheet
When considering thermal design, operation should be maintained within the following conditions.
(The temperature mentioned below is a guaranteed temperature, therefore, margins must be considered.)
1. Ambient temperature Ta is 85°C and below.
2. Junction temperature Tj is 150°C and below.
The junction temperature Tj can be determined as follows:
Calculation based on ambient temperature Ta
Tj=Ta+θj-a×W
<Reference Value>
・θj-a: SOT89-3K 74.8°C/W
JEDEC standard 4 layers PCB
Board size: 114.3mm × 76.2mm × 1.6mm
Most of the heat loss that occurs in BDxxFA1FP3 is generated from the output Pch FET. Power loss is determined by the
product of voltage drop across Vcc-Vo and the output current. Check the conditions of output voltage and output current to be
used between Vcc-Vo and compare with the power dissipation characteristics.
In addition, power dissipation may change significantly due to board conditions because BDxxFA1FP3 uses power package. It is
important to consider the board size to be used before proceeding with the design.
Power consumption [W] = { Input voltage (Vcc) – Output voltage (Vo) } × Output current (Io: Ave)
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TSZ02201-0GAG0A600600-1-2
08.Jun.2015 Rev.003