BDXXFA1FP3 Datasheet, PDF (11/17 Pages) Rohm – High accuracy output voltage

BDxxFA1FP3
Datasheet
●Operational Notes
(1) Absolute Maximum Value Rate
Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all
destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit
protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum
ratings.
(2) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
(3) Power supply line
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
(4) Ground voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
(5) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions.
(6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused be conductive particles caught between the pins.
(7) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8) ASO
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
(9) Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature
of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its operation. Do not
continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always
be activated.
BDxxFA1FP3
TSD ON Temperature [°C] (typ.)
175
Hysteresis Temperature [°C] (typ.)
10
(10) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from electro static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111ï½¥15ï½¥001
11/14
TSZ02201-0GAG0A600600-1-2
08.Jun.2015 Rev.003