BD9E302EFJ Datasheet, PDF (5/44 Pages) Rohm – Integrated MOSFET Single Synchronous Buck DC/DC Converter

BD9E302EFJ
Datasheet
 Absolute Maximum Ratings (Ta = 25C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VIN
-0.3 to +30
V
EN Input Voltage
VEN
-0.3 to VIN
V
Voltage from GND to BOOT
VBOOT
-0.3 to +35
V
Voltage from SW to BOOT
⊿VBOOT
-0.3 to +7
V
FB Input Voltage
VFB
-0.3 to +7
V
COMP Input Voltage
VCOMP
-0.3 to +7
V
SW Input Voltage
VSW
-0.5 to VIN +0.3
V
Operating Ambient Temperature Range
Topr
-40 to +85
C
Storage Temperature Range
Tstg
-55 to +150
C
Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance^{(Note 1)}
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s^{(Note 3)}
2s2p^{(Note 4)}
HTSOP-J8
Junction to Ambient
θJA
206.4
45.2
°C/W
Junction to Top Characterization Parameter^{(Note 2)}
ΨJT
21
13
°C/W
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
(Note 4)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
4 Layers
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
(Note 5) This thermal via connects with the copper pattern of all layers..
Thermal Via^{(NOTE 5)}
Pitch
Diameter
1.20mm
Φ0.30mm
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
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TSZ02201-0J3J0AJ00890-1-2
27.Apr.2016 Rev.002