BD95500MUV Datasheet, PDF (2/21 Pages) Rohm – Switching Regulator with MOSFET for DDR-SDRAM Cores

BD95500MUV
Technical Note
●Maximum Absolute Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Input Voltage 1
Input Voltage 2
Input Voltage 3
VCC
VDD
VIN
7 ^*1
V
7 ^*1
V
24 ^*1
V
BOOT Voltage
BOOT
30
V
BOOT-SW Voltage
BOOT-SW
7
V
LG Voltage
LG
VDD
V
REF Voltage
REF
VCC
V
Output Voltage
VOUT/Is+/Is-
VCC
V
ILIM/SS/FS/MODE Voltage
ILIM/SS/FS/MODE
VCC
V
VREG Voltage
VREG
VCC
V
EN Input Voltage
EN
7
V
Output Current (Average)
Isw
Power Dissipation 1
Pd1
Power Dissipation 2
Pd2
Power Dissipation 3
Pd3
Power Dissipation 4
Pd4
6
A
0.54 ^*2
W
1.00 ^*3
W
3.77 ^*4
W
4.66 ^*5
W
Operating Temperature Range
Topr
-10～+100
℃
Storage Temperature Range
Tstg
-55～+150
℃
Junction Temperature
Tjmax
+150
℃
*1 Not to exceed Pd, ASO, and Tjmax=150℃.
*2 Reduced by 4.3mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board )
*3 Reduced by 8.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 1 layer.
(Copper foil area : 0mm²))
*4 Reduced by 30.1mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 4 layers.
(1^st and 4^th copper foil area : 20.2mm², 2^nd and 3^rd copper foil area : 5505mm²))
*5 Reduced by 37.3mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 4 layers.
(All copper foil area : 5505mm²))
●Operating Conditions (Ta=25℃)
Parameter
Symbol
Input Voltage 1
VCC
Input Voltage 2
VDD
Input Voltage 3
VIN
BOOT Voltage
BOOT
SW Voltage
SW
BOOT-SW Voltage
BOOT-SW
MODE Input Voltage
MODE
EN Input Voltage
EN
Output Adjustable Voltage
REF
Is Input Voltage
Is+/Is-
MIN ON Time
Tonmin
*This product should not be used in a radioactive environment.
Ratings
MIN
MAX
4.5
5.5
4.5
5.5
3.0
20
4.5
25
-0.7
20
4.5
5.5
0
5.5
0
5.5
0.7
2.0
0.7
2.7
-
200
Unit
V
V
V
V
V
V
V
V
V
V
nsec
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2010.05 - Rev.C