BU7150NUV_15 Datasheet, PDF (15/22 Pages) Rohm – Headphone Amplifier Designed for 0.93V Low Voltage Operation

BU7150NUV
Technical Note
[About a thermal PAD]
This product has a thermal PAD at the rear side of the package for heat dissipation and connecting it to GND
plane will provide better heat dissipation. In the event that the IC will exceed its allowable heat dissipation, connect
the thermal PAD to GND plane. Furthermore, heat dissipation properties can be improved by increasing the
copper foil area of the printed board, which can also provide high allowable dissipation. Additionally, exceeding the
allowable dissipation will lead to deterioration of the IC.
Please handle the thermal PAD according to the list shown below by a setting mode and supply voltage.
Setting
SE mode (RL=16Ω )
SE mode VDD < 2.9V
(RL=8Ω)
VDD ≥ 2.9V
Allowable Dissipation
Handling of Thermal PAD
I do not exceed it
It is open or is connected to the GND pattern ^{(Note 3)}
Exceed
I am connected to the GND pattern ^{(Note 3)}
(I allow even opening by a condition. Reference
Figure42)
Note 3 Thermal PAD is not a GND terminal. Please give the GND electric potential from VSS terminal (6pin).
•
Condition 1: When mounted on 1-layer 74.2 mm x 74.2 mm x 1.6 mm
glass-epoxy PCB
No copper foil (only mounting pattern)
Condition 2: When mounted on 4-layer 74.2 mm x 74.2 mm x 1.6 mm
glass-epoxy PCB6.28mm² copper foil (back layer)
and 5,505mm² copper foil (layers 2 & 3)
Operation Temperature : Topr [°C]
Figure 41. Power Dissipation vs Temperature
When mounted on 1-layer 74.2 mm x 74.2 mm x 1.6 mm
glass-epoxy PCB
No copper heat sink (only mounting pattern)
Supply Voltage : VDD [V]
Figure 42. Handling of Thermal PAD Condition (BTL Mode)
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15/18
2015.1 - Rev.E