SBF4089Z Datasheet, PDF (6/8 Pages) RF Micro Devices – DC to 500MHz, CASCADABLE InGaP/GaAs HBT MMIC AMPLIFIER

SBF4089Z
Evaluation Board Layout
Mounting Instructions
1. Note: For broadband RF unconditional stability do not put GND vias under the exposed backside GND paddle.
2. Solder the copper pad on the backside of the device package to the ground plane.
3. USe a large ground pad area with many plated through-holes as shown.
4. We recommend 1 or 2 ounce copper. Measurement for this data sheet were made on a 31mil thick FR-4 board with 1 ounce
copper on both sides.
Pin
1
2, 4
3
Function
RF IN
GND
RF OUT/BIAS
Description
RF input pin. This pin requires the use of an external DC-blocking capacitor chosen for the frequency of opera-
tion.
Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as
possible.
RF output and bias pin. DC voltage is present on this pin therefore a DC-blocking capacitor is necessary for
proper operation.
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DS111011