SDA-2000 Datasheet, PDF (5/8 Pages) RF Micro Devices – GaAs Distributed Amplifier

SDA-2000
Application Schematic
Die Drawing (Dimensions in microns)
Notes:
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No connection required for unlabeled bond pads
Die thickness is 0.102mm (4mil)
Typical bond pad is 0.100mm square
Backside metallization: gold
Backside metal is ground
Bond pad metallization: gold
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
DS140204
For sales or technical support, contact RFMD at +1.336.678.5570 or [e-mail].
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
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