RF2722_1 Datasheet, PDF (26/26 Pages) RF Micro Devices – GSM/GPRS/EDGE RECEIVER

RF2722
Proposed
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the
device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern shown has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
Via
0.203 - 0.330 (mm)
Finished Hole
0.5 - 1.2 (mm) Grid
Figure 3. Thermal Pad and Via Design (RFMD Qualification)
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
Rev A4 DS050919