RF2722_1 Datasheet, PDF (25/26 Pages) RF Micro Devices – GSM/GPRS/EDGE RECEIVER

Proposed
RF2722
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
A = 0.74 x 0.38 (mm) Typ.
B = 0.38 x 0.74 (mm) Typ.
C = 3.60 (mm) Sq.
0.50 Typ.
3.50 Typ.
Dimensions in mm.
Pin 32
Pin 1
BBBBBBBB
Pin 24
A
0.50 Typ.
A
A
A
A
A ^{1.75 Typ.}
A
A
C
3.50 Typ.
A
A
A
A
A
A
0.55 Typ.
A
A
BBBBBBBB
0.55 Typ.
1.75 Typ.
Pin 16
Figure 2. PCB Solder Mask (Top View)
Rev A4 DS050919
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
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