PD16823_15 Datasheet, PDF (9/10 Pages) Renesas Technology Corp – MONOLITHIC H BRIDGE DRIVER

µPD16823
RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the conditions shown below.
For soldering methods and conditions other than those listed below, consult NEC.
For details of the recommended soldering conditions, refer to Information Document “Semiconductor Device
Mounting Technology Manual” (C10535E).
Soldering Method
Soldering Condition
Symbol of Recommended
Soldering
Infrared reflow
Package peak temperature: 235 °C, Time: 30 seconds MAX. (210 °C MIN.)
Number of times: 2 MAX., Number of days: None^Note, Flux: Rosin-based
flux with little chlorine component (chlorine: 0.2 Wt% MAX.)
IR35-00-2
VPS
Package peak temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.)
Number of times: 2 MAX., Number of days: None^Note, Flux: Rosin-based
flux with little chlorine component (chlorine: 0.2 Wt% MAX.)
VP15-00-2
Wave soldering
Package peak temperature: 260 °C, Time: 10 seconds MAX.,
Preheating temperature: 120 °C MAX., Number of times: 1, Flux:
Rosin-based flux with little chlorine component (chlorine: 0.2 Wt% MAX.)
WS60-00-1
Note The number of days during which the product can be stored at 25 °C 65% RH MAX. after the dry pack was
opened.
Caution Do not use two or more soldering methods in combination.
REFERENCE DOCUMENTS
Document Name
NEC Semiconductor Device Reliability/Quality Control System
Guide to Quality Assurance for Semiconductor Devices
Safe Operating Area of Power MOS FET
Document No.
C11745E
MEI-1202
TEA-1037
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