2SC4095_15 Datasheet, PDF (7/10 Pages) Renesas Technology Corp – MICROWAVE LOW NOISE AMPLIFIER NPN SILICON EPITAXIAL TRANSISTOR 4 PINS MINI MOLD

2SC4095
RECOMMENDED SOLDERING CONDTITIONS
The following conditions (see table below) must be met then soldering this product. Please consult with our sales
offices in case other soldering process is used, or in case soldering is done under different contions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “SMT MANUAL” (IEI-1207).
2SC4095
Soldering process
Soldering conditions
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Peak package’s surface temperature: 230 C or below,
Reflow time:
30 seconds or below (210 C or higher),
Number of reflow process: 1, Exposure limit*: None
Peak package’s surface temperature: 215 C or below,
Reflow time:
40 seconds or below (200 C or higher),
Number of reflow process: 1, Exposure limit*: None
Solder temperature:
Flow time:
Number of reflow process:
260 C or below,
10 seconds or below,
1, Exposure limit*: None
Terminal temperature:
Flow time:
Exposure limit*:
300 C or below,
3 seconds or below,
None
*: Exposure limit before soldering after dry-pack package is opened.
 Storage conditions: 25 C and relative humidity at 65 % or less.
Note: Do not apply more than a single process at once, except for “Partial heating method”.
Symbol
IR30-00-1
VP15-00-1
WS60-00-1
5