UPD78P083GB-3BS-MTX-A Datasheet, PDF (51/58 Pages) Renesas Technology Corp – 8-BIT SINGLE-CHIP MICROCONTROLLER

µPD78P083
10. RECOMMENDED SOLDERING CONDITIONS
*
It is recommended that the µPD78P083 be soldered under the following conditions.
For details on the recommended soldering conditions, refer to information document "Semiconductor Device Mounting
Technology Manual" (C10535E).
For soldering methods and conditions other than those recommended, please contact your NEC sales representative.
Table 10-1. Soldering Conditions for Surface Mount Types
µPD78P083GB-3B4
: 44-pin plastic QFP (10 x 10 mm)
µPD78P083GB-3BS-MTX : 44-pin plastic QFP (10 x 10 mm)
Soldering Method
Infrared ray reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Package peak temperature: 235˚C, Reflow time: 30 seconds or
less (at 210˚C or higher), Number of reflow processes: 2 or less
< Cautions >
(1) Wait for the device temperature to return to normal after the
first reflow before starting the second reflow.
(2) Do not perform flux cleaning with water after the first reflow.
Package peak temperature: 215˚C, Reflow time: 40 seconds or
less (at 200˚C or higher), Number of reflow processes: 2 or less
< Cautions >
(1) Wait for the device temperature to return to normal after the
first reflow before starting the second reflow.
(2) Do not perform flux cleaning with water after the first reflow.
Solder temperature: 260˚C or below, Flow time: 10 seconds or
less, Number of flow processes: 1,
Preheating temperature: 120˚C max. (package surface
temperature)
Pin temperature: 300˚C or below,
Flow time: 3 seconds or less (per pin row)
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
—
Caution Do not use different soldering methods together (except for partial heating method).
Table 10-2. Soldering Condition for Hole-Through Types
µPD78P083CU : 42-pin plastic shrink DIP (600 mil)
µPD78P083DU : 42-pin ceramic shrink DIP (with window) (600 mil)
Soldering Method
Wave Soldering
(only pins)
Partial heating
Soldering Conditions
Solder temperature: 260°C or below, Flow time: 10 seconds or less
Pin temperature: 300°C or below, Flow time: 3 seconds or less (per pin)
Caution Apply wave soldering only to the pins and be careful so as not to bring solder into direct contact with
the package.
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