S12744EJ4V0DS00_15 Datasheet, PDF (22/26 Pages) Renesas Technology Corp – 5000 PIXELS CCD LINEAR IMAGE SENSOR

μ PD3739
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
to consult with our sales offices.
Type of Through-hole Device
μ PD3739D-A: CCD linear image sensor 22-pin ceramic DIP (CERDIP) (10.16 mm (400))
Process
Conditions
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Partial heating method Pin temperature: 380°C or below, Heat time: 3 seconds or less (per pin).
Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the glass cap.
The optical characteristics could be degraded by such contact.
2. Soldering by the solder flow method may have deleterious effects on prevention of glass cap
soiling and heat resistance. So the method cannot be guaranteed.
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Data Sheet S12744EJ4V0DS