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RJK0304DPB Datasheet, PDF (2/7 Pages) Renesas Technology Corp – Silicon N Channel Power MOS FET Power Switching
RJK0304DPB
Electrical Characteristics
Item
Symbol Min
Drain to source breakdown voltage V(BR)DSS
30
Gate to source leak current
IGSS
—
Zero gate voltage drain current
IDSS
—
Gate to source cutoff voltage
VGS(off)
1.2
Static drain to source on state
resistance
RDS(on)
—
RDS(on)
—
Forward transfer admittance
|yfs|
—
Input capacitance
Ciss
—
Output capacitance
Coss
—
Reverse transfer capacitance
Crss
—
Gate Resistance
Rg
—
Total gate charge
Qg
—
Gate to source charge
Qgs
—
Gate to drain charge
Qgd
—
Turn-on delay time
td(on)
—
Rise time
tr
—
Turn-off delay time
td(off)
—
Fall time
tf
—
Body–drain diode forward voltage
VDF
—
Body–drain diode reverse recovery
trr
—
time
Notes: 4. Pulse test
Typ
—
—
—
—
4.0
5.5
60
2500
850
130
0.5
17
6.7
3.7
8.5
3.2
41
4.0
0.84
35
Max
—
± 0.1
1
2.5
4.8
7.2
—
—
—
—
—
—
—
—
—
—
—
—
1.10
—
Unit
V
µA
µA
V
mΩ
mΩ
S
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
V
ns
(Ta = 25°C)
Test Conditions
ID = 10 mA, VGS = 0
VGS = +16/–12 V, VDS = 0
VDS = 30 V, VGS = 0
VDS = 10 V, ID = 1 mA
ID = 17.5 A, VGS = 10 V Note4
ID = 17.5 A, VGS = 4.5 V
Note4
ID = 17.5 A, VDS = 10 V Note4
VDS = 10 V, VGS = 0,
f = 1 MHz
VDD = 10 V, VGS = 4.5 V,
ID = 35 A
VGS = 10 V, ID = 17.5 A,
VDD ≅ 10 V,RL = 0.57 Ω,
Rg = 4.7 Ω
IF = 35 A, VGS = 0 Note4
IF = 35 A, VGS = 0
diF/ dt = 100 A/ µs
Rev.6.00 Apr 19, 2006 page 2 of 6