PD16715A_15 Datasheet, PDF (16/18 Pages) Renesas Technology Corp – 384-OUTPUT TFT-LCD SOURCE DRIVER(COMPATIBLE WITH 64-GRAY SCALES)

µ PD16715A
7. RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met for soldering conditions of the µPD16715A.
For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).
Please consult with our sales offices in case other soldering process is used, or in case the soldering is done
under different conditions.
Type of Surface Mount Device
µPD16715AN-××× : TCP (TAB package)
Mounting Condition
Mounting Method
Thermocompression Soldering
ACF
(Adhesive
Conductive Film)
Condition
Heating tool 300 to 350°C, heating for 2 to 3 seconds: pressure 100g
(per solder)
Temporary bonding 70 to 100°C: pressure 3 to 8 kg/cm² : time 3 to 5
seconds.
Real bonding 165 to 180°C: pressure 25 to 45 kg/cm² : time 30 to 40
seconds. (When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite, Ltd.)
Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more packaging methods at a time.
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Data Sheet S13944EJ2V0DS00