PD16818_15 Datasheet, PDF (15/17 Pages) Renesas Technology Corp – MONOLITHIC DUAL H BRIDGE DRIVER CIRCUIT

µPD16818
RECOMMENDED SOLDERING CONDITIONS
The µPD16818 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Surface Mount Type
µPD16818GS
20-pin plastic SOP (7.62 mm (300))
Soldering Method
Soldering Conditions
Symbol of Recommended
Soldering
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds MAX.(210°C MIN.),
Number of times: 3 MAX., Number of days: None^Note, Flux: Rosin-based
flux with little chlorine component (chlorine: 0.2 Wt% MAX.)
IR35-00-3
VPS
Package peak temperature: 215°C, Time: 40 seconds MAX.(200°C MIN.),
Number of times: 3 MAX., Number of days: None^Note, Flux: Rosin-based
flux with little chlorine component (chlorine: 0.2 Wt% MAX.)
VP15-00-3
Wave soldering
Package peak temperature: 260°C, Time: 10 seconds MAX., Preheating
temperature: 120 °C MAX., Number of times: 1, Flux: Rosin-based flux
with little chlorine component (chlorine: 0.2 Wt% MAX.)
WS60-00-1
Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25 °C, 65 %
RH MAX.
Caution Do not use two or more soldering methods in combination.
Data Sheet S11365EJ2V1DS
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