NP80N055MDG_15 Datasheet, PDF (11/12 Pages) Renesas Technology Corp – SWITCHING N-CHANNEL POWER MOS FET

NP80N055MDG, NP80N055NDG, NP80N055PDG
TAPE INFORMATION (NP80N055PDG)
There are two types (-E1B, -E2B) of taping depending on the direction of the device.
Draw-out side
MARKING INFORMATION
−E1B TYPE
NEC
80N055
DG
Reel side
−E2B TYPE
Pb-free plating marking
Abbreviation of part number
Lot code
RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Soldering Conditions
Infrared reflow
NP80N055PDG
Wave soldering
NP80N055MDG,
NP80N055NDG
Maximum temperature (Package's surface temperature): 260°C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220°C: 60 seconds or less
Preheating time at 160 to 180°C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Solder temperature): 260°C or below
Time: 10 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Partial heating
NP80N055MDG,
NP80N055NDG,
NP80N055PDG
Maximum temperature (Pin temperature): 350°C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Recommended
Condition Symbol
IR60-00-3
THDWS
P350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet D19796EJ1V0DS
9