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UPD48288209AF1 Datasheet, PDF (1/54 Pages) Renesas Technology Corp – 288M-BIT Low Latency DRAM | |||
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µPD48288209AF1
µPD48288218AF1
µPD48288236AF1
Datasheet
288M-BIT Low Latency DRAM
Common I/O
R10DS0254EJ0101
Rev. 1.01
Jan. 15, 2016
Description
The µPD48288209AF1 is a 33,554,432-word by 9 bit, the µPD48288218AF1 is a 16,777,216-word by 18 bit and the
µPD48288236AF1 is a 8,388,608-word by 36 bit synchronous double data rate Low Latency RAM fabricated with
advanced CMOS technology using one-transistor memory cell.
The µPD48288209AF1, µPD48288218AF1 and µPD48288236AF1 integrate unique synchronous peripheral circuitry
and a burst counter. All input registers controlled by an input clock pair (CK and CK#) are latched on the positive edge
of CK and CK#. These products are suitable for application which require synchronous operation, high speed, low
voltage, high density and wide bit configuration.
Specification
⢠Density: 288M bit
⢠Organization
- Common I/O: 4M words x 9 bits x 8 banks
2M words x 18 bits x 8 banks
1M words x 36 bits x 8 banks
⢠Operating frequency: 533 / 400 / 300 MHz
⢠Interface: HSTL I/O
⢠Package: 144-pin FBGA
- Package size: 18.5 x 11
- Lead free
⢠Power supply
- 2.5 V VEXT
- 1.8 V VDD
- 1.5 V or 1.8 V VDDQ
⢠Refresh command
- Auto Refresh
- 8192 cycle / 32 ms for each bank
- 64K cycle / 32 ms for total
⢠Operating case temperature : Tc = 0 to 95°C
Features
⢠SRAM-type interface
⢠Double-data-rate architecture
⢠PLL circuitry
⢠Cycle time:
1.875 ns @ tRC = 15 ns
2.5 ns @ tRC = 15 ns
2.5 ns @ tRC = 20 ns
3.3 ns @ tRC = 20 ns
⢠Non-multiplexed addresses
⢠Multiplexing option is available.
⢠Data mask for WRITE commands
⢠Differential input clocks (CK and CK#)
⢠Differential input data clocks (DK and DK#)
⢠Data valid signal (QVLD)
⢠Programmable burst length: 2 / 4 / 8 (x9 / x18 / x36)
⢠User programmable impedance output (25 ⦠- 60 â¦)
⢠JTAG boundary scan
R10DS0254EJ0101 Rev. 1.01
Jan. 15, 2016
Page 1 of 53
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