HYS64T16000HU Datasheet, PDF (5/73 Pages) Qimonda AG – 240-Pin Unbuffered DDR2 SDRAM Modules

Internet Data Sheet
HYS[64/72]T[16/32/64]0xxHU–[2.5/../5]–A
Unbuffered DDR2 SDRAM Modules
Product Type¹⁾
Compliance Code²⁾
Description
SDRAM Technology
PC2–3200
HYS64T16000HU–5–A
128MB 1Rx16 PC2–3200U–333–11–C1 1 Rank, Non-ECC 256 Mbit (x16)
HYS64T32001HU–5–A
256MB 1Rx8 PC2–3200U–333–11–A1
1 Rank, Non-ECC 256 Mbit (x8)
HYS72T32000HU–5–A
256MB 1Rx8 PC2–3200E–333–11–A1
1 Rank, ECC
256 Mbit (x8)
1) All product types end with a place code, designating the silicon die revision. Example: HYS64T16000HU–3.7–A, indicating Rev. “A” dies
are used for DDR2 SDRAM components. For all QIMONDA DDR2 module and component nomenclature see Chapter 6 of this data sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200U–444–11–C1”, where
4200U means Unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-11” means Column Address Strobe (CAS)
latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.1 and
produced on the Raw Card “C”.
DIMM
Density
128 MByte
256 MByte
512 MByte
Module
Organization
16M × 64
32M × 64
32M × 72
64M × 64
64M × 72
Memory
Ranks
1
1
1
2
2
ECC/
Non-ECC
Non-ECC
Non-ECC
ECC
Non-ECC
ECC
TABLE 3
Address Format
# of SDRAMs # of row/bank/column
bits
Raw
Card
4
13/2/9
C
8
13/2/10
A,D
9
13/2/10
A,F
16
13/2/10
E
18
13/2/10
G
Product Type¹⁾
DRAM Components¹⁾ DRAM Density
TABLE 4
Components on Modules
DRAM Organisation
Note²⁾
HYS64T16000HU
HYB18T256160AF
256 Mbit
16M × 16
HYS64T32001HU
HYB18T256800AF
256 Mbit
32M × 8
HYS64T64020HU
HYB18T256800AF
256 Mbit
32M × 8
HYS72T32000HU
HYB18T256800AF
256 Mbit
32M × 8
HYS72T64020HU
HYB18T256800AF
256 Mbit
32M × 8
1) Green Product
2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
Rev. 1.41, 2006-11
5
03062006-0GN5-WTPW