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HYS72T64400HFD-3S-B Datasheet, PDF (3/43 Pages) Qimonda AG – 240-Pin Fully-Buffered DDR2 SDRAM Modules | |||
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Internet Data Sheet
1
Overview
HYS72T[64/128/256][4/5][00/20]HFDâ3SâB
This chapter describes the main characteristics of the 240-Pin Fully-Buffered DDR2 SDRAM Modules product family.
1.1
Features
⢠240-pin Fully-Buffered ECC Dual-In-Line
DDR2 SDRAM Module for PC, Workstation and Server
main memory applications.
⢠Module organisation one rank 64M à 72,
one rank 128M Ã 72, two ranks 128M Ã 72,
two ranks 256M Ã72
⢠JEDEC Standard Double Data Rate 2
Synchronous DRAMs (DDR2 SDRAMs) with 1.8 V
(± 0.1 V) power supply.
⢠Built with 512Mb DDR2 SDRAMs in 60-ball FBGA
Chipsize Packages.
⢠Re-drive and re-sync of all address, command, clock and
data signals using AMB (Advanced Memory Buffer).
⢠High-Speed Differential Point-to-Point Link Interface at
1.5 V (Jedec standard pending).
⢠Host Interface and AMB component industry standard
compliant.
⢠Supports SMBus protocol interface for access to the AMB
configuration registers.
⢠Detects errors on the channel and reports them to the host
memory controller.
⢠Automatic DDR2 DRAM Bus Calibration.
⢠Automatic Channel Calibration.
⢠Full Host Control of the DDR2 DRAMs.
⢠Over-Temperature Detection and Alert.
⢠Hot Add-on and Hot Remove Capability.
⢠MBIST and IBIST Test Functions.
⢠Transparent Mode for DRAM Test Support.
⢠Low profile: 133.35mm x 30.35 mm
⢠240 Pin gold plated card connector with 1.00 mm contact
centers (JEDEC standard pending).
⢠Based on JEDEC standard reference card designs (Jedec
standard pending).
⢠SPD (Serial Presence Detect) with 256 Byte serial
E2PROM.Performance:
⢠RoHS Compliant Products1)
Product Type Speed Code
Speed Grade
max. Clock Frequency
min. RAS-CAS-Delay
min. Row Precharge Time
min. Row Active Time
min. Row Cycle Time
@CL5
@CL4
@CL3
TABLE 1
Performance for DDR2â667
â3S
Unit
PC2â5300 5â5â5
fCK5
333
fCK4
266
fCK3
200
tRCD
15
tRP
15
tRAS
45
tRC
60
â
MHz
MHz
MHz
ns
ns
ns
ns
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.2, 2006-02
3
09142006-Q5TN-B9NE
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