HYS72T512022HFN-3.7-A Datasheet, PDF (3/32 Pages) Qimonda AG – 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM

Internet Data Sheet
1
Overview
HYS72T512[0/1]22HFN–3.7–A
This chapter describes the main characteristics of the 240-Pin Fully-Buffered DDR2 SDRAM Modules product family.
1.1
Features
• 240-pin Fully-Buffered ECC Dual-In-Line
DDR2 SDRAM Module for PC, Workstation and Server
main memory applications.
• Module organisation two ranks 512M ×72
• JEDEC Standard Double Data Rate 2
Synchronous DRAMs (DDR2 SDRAMs) with 1.8 V
(± 0.1 V) power supply.
• 4GB Module built with 1Gb Dual Die DDR2 SDRAMs in 71-
ball FBGA Common Package.
• Re-drive and re-sync of all address, command, clock and
data signals using AMB (Advanced Memory Buffer).
• High-Speed Differential Point-to-Point Link Interface at
1.5 V (Jedec standard pending).
• Host Interface and AMB component industry standard
compliant.
• Supports SMBus protocol interface for access to the AMB
configuration registers.
• Detects errors on the channel and reports them to the host
memory controller.
• Automatic DDR2 DRAM Bus Calibration.
• Automatic Channel Calibration.
• Full Host Control of the DDR2 DRAMs.
• Over-Temperature Detection and Alert.
• Hot Add-on and Hot Remove Capability.
• MBIST and IBIST Test Functions.
• Transparent Mode for DRAM Test Support.
• Low profile: 133.35mm × 30.35 mm
• 240 Pin gold plated card connector with 1.00mm contact
centers (JEDEC standard pending).
• Based on JEDEC standard reference card designs (Jedec
standard pending).
• SPD (Serial Presence Detect) with 256 Byte serial
E²PROM.Performance:
• RoHS Compliant Products¹⁾
Product Type Speed Code
Speed Grade
max. Clock Frequency @CL5
f_CK5
@CL4
f_CK4
@CL3
f_CK3
min. RAS-CAS-Delay
t_RCD
min. Row Precharge Time
t_RP
min. Row Active Time
t_RAS
min. Row Cycle Time
t_RC
TABLE 1
Performance for DDR2–533
–3.7
Unit
PC2–4200 4–4–4
266
266
200
15
15
45
60
—
MHz
MHz
MHz
ns
ns
ns
ns
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.1, 2006-11
3
03292006-WK9O-3A6G