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HYS64D32301HU Datasheet, PDF (16/39 Pages) Qimonda AG – 184-Pin Unbuffered Double Data Rate SDRAM
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Internet Data Sheet
HYS[64/72]D[16/32/128]3xxHU–[5/6]–C
Unbuffered DDR SDRAM Modules
Parameter
Symbol
Values
Unit Note/Test Condition 1)
Min.
Typ.
Max.
Input High (Logic1) Voltage
Input Low (Logic0) Voltage
Input Voltage Level,
CK and CK Inputs
Input Differential Voltage,
CK and CK Inputs
VI-Matching Pull-up Current
to Pull-down Current
VIH(DC)
VIL(DC)
VIN(DC)
VID(DC)
VIRatio
VREF + 0.15
–0.3
–0.3
0.36
0.71
VDDQ + 0.3 V
6)
VREF – 0.15 V
6)
VDDQ + 0.3 V
6)
VDDQ + 0.6 V
6)7)
1.4
—
8)
Input Leakage Current
II
–2
2
µA Any input 0 V ≤ VIN ≤ VDD;
All other pins not under test
= 0 V 9)
Output Leakage Current
IOZ
–5
Output High Current, Normal IOH
—
Strength Driver
5
–16.2
µA DQs are disabled;
0 V ≤ VOUT ≤ VDDQ 9)
mA VOUT = 1.95 V
Output Low Current, Normal IOL
16.2
Strength Driver
—
mA VOUT = 0.35 V
1) 0 °C ≤ TA ≤ 70 °C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V; VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V (DDR400);
2) DDR400 conditions apply for all clock frequencies above 166 MHz
3) Under all conditions, VDDQ must be less than or equal to VDD.
4) Peak to peak AC noise on VREF may not exceed ± 2% VREF (DC). VREF is also expected to track noise variations in VDDQ.
5) VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and
must track variations in the DC level of VREF.
6) Inputs are not recognized as valid until VREF stabilizes.
7) VID is the magnitude of the difference between the input level on CK and the input level on CK.
8) The ratio of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire temperature and
voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the maximum difference between
pull-up and pull-down drivers due to process variation.
9) Values are shown per pin.
Rev. 1.21, 2006-09
22
03292006-RA8T-MSZL
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