PT6315 Datasheet, PDF (25/26 Pages) Princeton Technology Corp – VFD Driver/Controller IC

VFD Driver/Controller IC
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PT6315
Symbol
A
A1
A2
b
-
D
D1
e
E
E1
θ
θ1
θ2
θ3
C
L
L1
R1
R2
S
Min.
Nom.
Max.
-
-
1.60
0.05
-
0.15
1.35
1.40
1.45
0.30
0.37
0.45
-
12.00 BSC
10.00 BSC
0.80 BSC
12.00 BSC
10.00 BSC
0^o
3.5^o
7^o
0^o
-
-
11^o
12^o
13^o
11^o
12^o
13^o
0.09
-
0.20
0.45
0.60
0.75
1.00 REF
0.08
-
-
0.08
-
0.20
0.20
-
-
Notes:
1. Controlling Dimensions are in millimeters .
2. Dimensioning and tolerancing per ASME Y14.5M-1994.
3. The top packge body size may be smaller than the bottom package size by as much as 0.15mm.
4. Datums A-B and D to be determined at datum plane H.
5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. D1 and
E1 are maximum plastic body size dimensions including mold mismatch.
6. Details of pin1 identifier are optional but must be located within the zone indicated.
7. Dimension b does not include dambar protrusion. Alowable dambar protrusion shall not cause the lead to
exceed the maximum b dimension by more than 0.08mm. Dambar cannot be located on the lower radius or
the foot. Minimum space between protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm pitch
packages.
8. A1 is defined as the distance from the seating plane to the lowest point on the package body.
9. Refer to JEDEC STD MS-026 Variation BCB
JEDEC is the trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
PT6315 v2.0
Page 25
Sep. 2002