PE9354 Datasheet, PDF (5/7 Pages) Peregrine Semiconductor Corp. – SPDT High Power UltraCMOS™ RF Switch Rad hard for Space Applications

PE9354
Product Specification
Evaluation Kit Information
Evaluation Kit
The SPDT Switch Evaluation Kit board was designed to
ease customer evaluation of the PE9354 SPDT switch.
The RF common port is connected through a 50 Ω
transmission line to the top left SMA connector, J1.
Port 1 and Port 2 are connected through 50 Ω
transmission lines to the top two SMA connectors on
the right side of the board, J2 and J3. A through
transmission line connects SMA connectors J4 and J5.
This transmission line can be used to estimate the loss
of the PCB over the environmental conditions being
evaluated.
The board is constructed of a two metal layer FR4
material with a total thickness of 0.031”. The bottom
layer provides ground for the RF transmission lines.
The transmission lines were designed using a coplanar
waveguide with ground plane model using a trace width
of 0.030”, trace gaps of 0.007”, dielectric thickness of
0.028”, metal thickness of 0.0014” and ε_r of 4.4.
J6 provides a means for controlling DC and digital
inputs to the device. Starting from the lower left pin,
the second pin to the right (J2-3) is connected to the
device CNTL input. The fourth pin to the right (J2-7) is
connected to the device V_DD input. A decoupling
capacitor (100 pF) is provided on both CTRL and V_DD
traces. It is the responsibility of the customer to
determine proper supply decoupling for their design
application. Removing these components from the
evaluation board has not been shown to degrade RF
performance.
The ground plane has been removed from beneath the
device for performance issues. It was found that
insertion loss dips (suck-outs) were experienced due to
the capacitive effect of the metal package sitting
insulated by the solder-mask on the ground plane. All
Figure 12. Evaluation Board Layouts
data specified and shown on this datasheet was taken
using this evaluation board configuration. For optimal
performance, the package may be soldered directly to
the ground plane, but the reliability issues associated
with this mounting must be addressed by the customer.
Figure 13. Evaluation Board Schematic
Peregrine specification 102/0129
Document No. 70-0099-02 │ www.psemi.com
©2004-2006 Peregrine Semiconductor Corp. All rights reserved.
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