PSHI2506 Datasheet, PDF (2/4 Pages) Powersem GmbH – IGBT Module PSHI H-Bridge Configuration

PSHI 25/06
Reverse diodes (FRED)
Symbol Conditions
I_F25
T_C = 25°C
I_F80
T_C = 80°C
Maximum Ratings
18.5
A
12.0
A
Symbol
V_F
I_RM
t_rr
R_thJC
R_thJH
Conditions
I_F = 15 A; T_VJ = 25°C
T_VJ = 125°C
I_F = 10 A; di_F/dt = 400 A/µs; T_VJ = 125°C
V_R = 300 V; V_GE = 0 V
with heatsink compound (0.42 K/m.K; 50 µm)
Characteristic Values
min. typ. max.
2.58 2.64 V
1.8
V
7
A
70
ns
3.5 K/W
7
K/W
Temperature Sensor NTC
Symbol Conditions
R₂₅
B_25/50
T = 25°C
Characteristic Values
min. typ. max.
455 470
3375
485 kΩ
K
Module
Symbol
T_VJ
T_stg
V_ISOL
M_d
a
Conditions
I_ISOL ≤ 1 mA; 50/60 Hz
Mounting torque (M4)
Max. allowable acceleration
Maximum Ratings
-40...+150
-40...+150
3000
1.5 - 2.0
14 - 18
50
°C
°C
V~
Nm
lb.in.
m/s²
Symbol
d_S
d_A
Weight
Conditions
Creepage distance on surface (Pin to heatsink)
Strike distance in air (Pin to heatsink)
Characteristic Values
min. typ. max.
11.2
mm
11.2
mm
24
g
Package style and outline
Dimensions in mm (1mm = 0.0394“)
POWERSEM GmbH, Walpersdorfer Str. 53
 2003 POWERSEM reserves the right to change limits, test conditions and dimensions
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20