TFS757 Datasheet, PDF (13/36 Pages) Power Integrations, Inc. – Combined Two-Switch Forward and Flyback Power Supply Controllers with Integrated High Voltage MOSFETs

TFS757-764HG
2. Second a 15 mA threshold (I_BP(SD))for standby secondary OVP
latch-off. When the BYPASS pin current exceeds this
threshold, the standby and main converters are latched-off.
This latch can be reset by pulling the LINE-SENSE pin below
the line undervoltage threshold (I_L(SB-UVOFF)), or by discharging
the BYPASS pin below 4.7 V.
Note: unlike the TinySwitch-III the HiperTFS BYPASS pin capacitor
does not provide any programming capability. Instead the
recommended BYPASS pin capacitor should always be a 1 mF
(ceramic) capacitor.
Main and Standby Line Overvoltage Detection (OV)
The overvoltage threshold is included in the device, and can be
used to disable the device during overvoltage (with the use of
an additional external signal Zener). The overvoltage threshold
is set sufficiently high to prevent accidental triggering during
boost PFC overshoot conditions. When the overvoltage
condition is triggered, it will simultaneously shutdown both the
Main and Standby. The overvoltage feature is intended for use
with external components (circuitry), to program the overvoltage
threshold independently of the undervoltage thresholds (see the
Applications section for details).
Output Power Table
Product ²
TFS757HG
TFS758HG
TFS759HG
TFS760HG
TFS761HG
TFS762HG
TFS763HG
TFS764HG
Two-Switched Forward
380 V
Continuous¹ Continuous¹
(25 °C)
(50 °C)
Peak
(50 °C)
193 W
163 W
228 W
236 W
200 W
278 W
280 W
235 W
309 W
305 W
258 W
358 W
326 W
276 W
383 W
360 W
304 W
407 W
388 W
327 W
455 W
414 W
344 W
530 W
Flyback
100 V - 400 V
50 °C
20 W
20 W
20 W
20 W
20 W
20 W
20 W
20 W
Table 5. Output Power Table.
Notes:
1. Maximum practical continuous power in an open frame design with adequate
heat sinking (assuming heat sink θ_C-A of <4 °C/W), measured at specified
ambient temperature (see Key Applications Considerations for more information).
2. Package: eSIP16/12. (Note: Direct attach to heat sink, does not require
insulation SIL pad)
High-Power eSIP Package
The HiperTFS package is designed to minimize the physical size
of the device, while maintaining a low thermal impedance and
sufficient electrical spacing for the pins. The package has 12
functional pins with 4 pins removed for increased pin-to-pin
spacing between high-voltage pins. The low-side two-switch
forward and flyback MOSFETs have a thermal impedance of
less than 1 °C/W to the exposed pad on the back of the
package. Since this pad is referenced to the SOURCE pin
(Source), it is at electrical ground potential and thus can be
connected to the heat sink without need for electrical insulation.
The high-side MOSFET is over-molded to achieve electrical
isolation and thus also allows direct connection to the heat sink.
www.powerint.com
13
Rev. C 02/11