CM450DXL-34SA Datasheet, PDF (4/9 Pages) Powerex Power Semiconductors – Dual IGBT NX-Series Module 450 Amperes/1700 Volts

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CM450DXL-34SA
Dual IGBT NX-Series Module
450 Amperes/1700 Volts
Electrical Characteristics, T_j = 25°C unless otherwise specified (continued)
NTC Thermistor Part
Characteristics
Zero Power Resistance
Deviation of Resistance
B Constant
Power Dissipation
Symbol
R₂₅
∆R/R
B_(25/50)
P₂₅
Test Conditions
T_C = 25°C^*4
T_C = 100°C, R₁₀₀ = 493Ω^*4
Approximate by Equation^*6
T_C = 25°C^*4
Min.
Typ.
Max. Units
4.85 5.00 5.15
kΩ
-7.3
—
+7.8
%
—
3375
—
K
—
—
10
mW
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance,
Case to Heatsink^*2
R_th(j-c)Q
R_th(j-c)D
R_th(c-f)
Per Inverter IGBT^*4
Per Inverter FWDi^*4
Thermal Grease Applied,
Per 1 Module^*4,*7
—
—
34
K/kW
—
—
52
K/kW
—
7
—
K/kW
Mechanical Characteristics
Mounting Torque
Creepage Distance
Clearance
Weight
Flatness of Baseplate
M_t
Main Terminals, M6 Screw
31
M_s
Mounting to Heatsink, M5 Screw
22
d_s
Terminal to Terminal
22.5
Terminal to Baseplate
16.8
d_a
Terminal to Terminal
15.5
Terminal to Baseplate
11.3
m
—
e_c
On Centerline X, Y^*8
±0
Recommended Operating Conditons, T_a = 25°C
DC Supply Voltage
Gate-Emitter Drive Voltage
V_CC
V_GE(on)
Applied Across C1-E2 Terminals
Applied Across
G1-Es1/G2-Es2 Terminals
External Gate Resistance
R_G
Per Switch
*4 Case temperature (T_C) and heatsink temperature (T_s) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6
B_(25/50) = In(RR₅₂₀₅)/(T₂¹₅
1
– _T50
)
R₂₅; Resistance at Absolute Temperature T₂₅ [K]; T₂₅ = 25 [°C] + 273.15 = 298.15 [K]
R₅₀; Resistance at Absolute Temperature T₅₀ [K]; T₅₀ = 50 [°C] + 273.15 = 323.15 [K]
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
Y
0
18.5
29.5
30.5
43.6
44.6
70.8
84.9
Th
Tr1
Tr1
Di1 Di1
Tr2
Di2
—
13.5
0
Tr1
Di1
Tr2 Tr2
Di2 Di2
35
40
in-lb
27
31
in-lb
—
—
mm
—
—
mm
—
—
mm
—
—
mm
690
— Grams
—
+100
µm
1000
15.0
1200
16.5
Volts
Volts
—
18
Ω
0
27.0
41.1
70.2
84.3
X
MOUNTING SIDE
MOUNTING SIDE
LABEL SIDE
– : CONCAVE
+ : CONVEX
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
4
06/13 Rev. 1