TICP206 Datasheet, PDF (5/7 Pages) Power Innovations Ltd – SILICON TRIACS

TICP206 SERIES
SILICON TRIACS
MARCH 1988 - REVISED MARCH 1997
MECHANICAL DATA
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
LP003 (TO-92) - Formed Leads Version
5,21
4,44
3,43 MIN.
2,67
2,03
LP003 Falls Within JEDEC
TO-226AA Dimensions
4,19
3,17
2,67
2,03
5,34
4,32
4,00 MAX.
0,56
0,40
1
2
3
2,90
0,41
2,40
0,35
2,90
2,40
ALL LINEAR DIMENSIONS IN MILLIMETERS
PRODUCT INFORMATION
MDXXAR
5