BUK7222-55A Datasheet, PDF (9/13 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
BUK7222-55A
TrenchMOS™ standard level FET
9. Package outline
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped)
SOT428
seating plane
y
A
E
A
A2
b2
A1
D1
mounting
base
E1
D
HE
L2
2
1
L
3
b1
e
b
wM A
e1
L1
c
0
10 20 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max.
A1⁽¹⁾
A2
b
b1
max.
b2
c
D ^D1 E ^E1
max. _max. max. min.
e
e1
HE
max.
L
L1
min.
L2
mm
2.38
2.22
0.65
0.45
0.89
0.71
0.89
0.71
1.1
0.9
5.36
5.26
0.4
0.2
6.22 4.81 6.73
5.98 4.45 6.47
4.0 2.285 4.57 ^{10.4 2.95}
9.6 2.55
0.5
0.7
0.5
Note
1. Measured from heatsink back to lead.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
SOT428
TO-252
SC-63
w
y
max.
0.2 0.2
ISSUE DATE
98-04-07
99-09-13
Fig 16. SOT428 (D-PAK).
9397 750 08221
Product specification
Rev. 01 — 17 April 2001
© Philips Electronics N.V. 2001. All rights reserved.
9 of 13