TDA8540 Datasheet, PDF (8/20 Pages) NXP Semiconductors – 4 X 4 video switch matrix

Philips Semiconductors
4 × 4 video switch matrix
Product specification
TDA8540
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
V_CC
P_tot
V_CC(D0,1), V_CC(D2,3)
IN0 to IN3
OUT0 to OUT3
D0, D1
SDA, SDL
S0 to S2
T_stg
T_j
V_es
PARAMETER
supply voltage (pin 13)
total power dissipation
driver supply voltage
video input voltage
video output voltage
control output voltage
I²C input/output voltage
sub-address input voltage
IC storage temperature
junction temperature
electrostatic handling
CONDITIONS
HBM; note 1
MM; note 2
MIN.
−0.3
−
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−55
−
−1 500
−200
MAX.
+9.1
750
+13.8
+7.2
+7.2
+7.2
+8.8
+8.8
+125
+150
+1 500
+200
UNIT
V
mW
V
V
V
V
V
V
°C
°C
V
V
Notes
1. Human Body Model (HBM): in accordance with UZW-BO/FQ-A302.
2. Machine Model (MM): in accordance with UZW-BO/FQ-B302 (stress reference pins: AGND and DGND
short-circuited and V_CC).
THERMAL CHARACTERISTICS
SYMBOL
R_{th j-a}
PARAMETER
thermal resistance from junction to ambient in free air
SOT146-1
SOT163-1
VALUE
60 (typ.)
85 (typ.)
UNIT
K/W
K/W
OPERATING CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
General
V_CC
T_amb
supply voltage (pin 13)
operating ambient temperature
Video inputs (pins 6, 8, 10 and 12)
C_I
V_I(p-p)
V_I(p-p)
external capacitor
C signal amplitude (peak-to-peak value)
CVBS or Y-signal amplitude
(peak-to-peak value)
note 1
note 2
Video drivers (pins 4 and 15)
R_D
external collector resistor
note 3
C_D
external decoupling capacitor
note 4
MIN. TYP. MAX. UNIT
7.2 −
0
−
8.8 V
70 °C
−
100 −
nF
−
−
1
V
−
−
1.5 V
−
25 −
Ω
−
22 −
µF
1995 Feb 06
8