SA5217 Datasheet, PDF (8/12 Pages) NXP Semiconductors – Postamplifier with link status indicator

Philips Semiconductors
Postamplifier with link status indicator
Product specification
SA5217
+V_CC
47µF
C1
C2
.01µF
GND
R2
D1
220
LED
C11
100pF
L2
10µH
C13
10µF
R3
33k
C12
.01µF
L3
10µH
C15
10µF
C14
.01µF
1 ^LED
2 CPKDET
3 ^THRESH
4 ^GNDA
5 ^FLAG
6 ^JAM
7 ^VCCD
8 ^VCCA
9 ^GNDD
10 TTLOUT
V_OUT (TTL)
C7
IN_1B 20
IN_1A ¹⁹
C_AZP ¹⁸
100pF
C8
C_AZN ¹⁷ _0.1µF
OUT_2B ¹⁶
C9
IN_8B ¹⁵
OUT_2A ¹⁴
IN_8A ¹³
R_HYST ¹²
R_{PKDET 11}
0.1µF
C10
0.1µF
8 ^GND
9 GND
10 ^GND
11 ^GND
12 OUT₁
13 GND
14 ^OUT2
R5
10k
R4
4k
V_{CC1 7}
V_CC2 6
NC ₅
I_{IN 4}
NC ₃
GND 2
GND ₁
L1
10µH
R1
C5
100 ^1.0µF
C4
.01µF
C3
10µF
.01µF
C6
BPF31
OPTICAL
INPUT
NOTE:
THE NE5210/NE5217 combination can operate at data rates in excess of 100Mb/s NRZ
Figure 6. A 50Mb/s Fiber Optic Receiver
SD00359
For more information on this application, please refer to Application
Brief AB1432.
Die Sales Disclaimer
Due to the limitations in testing high frequency and other parameters
at the die level, and the fact that die electrical characteristics may
shift after packaging, die electrical parameters are not specified and
die are not guaranteed to meet electrical characteristics (including
temperature range) as noted in this data sheet which is intended
only to specify electrical characteristics for a packaged device.
All die are 100% functional with various parametrics tested at the
wafer level, at room temperature only (25°C), and are guaranteed to
be 100% functional as a result of electrical testing to the point of
wafer sawing only. Although the most modern processes are
utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this
process. There is no post waffle pack testing performed on
individual die.
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
1998 Oct 07
8