BYC8X-600P_15 Datasheet, PDF (8/11 Pages) NXP Semiconductors – Hyperfast power diode

NXP Semiconductors
12. Package outline
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 2-lead TO-220 `full pack'
BYC8X-600P
Hyperfast power diode
SOD113
E
P
T⁽⁴⁾
L
A
A₁
z⁽²⁾
q
m
D
H_E
L₂
L₁₍₁₎
j⁽³⁾
k⁽³⁾
Q
1
2
b₁
b
w
c
e
0
5
10 mm
scale
Dimensions (mm are the original dimensions)
Unit
A A₁ b b₁
c
D
E
e
H_E
max
j⁽³⁾
max 4.6 2.9 0.9 1.1 0.7 15.8 10.3
2.7
mm nom
5.08 19.0
min 4.0 2.5 0.7 0.9 0.4 15.2 9.7
1.7
Notes
1. Terminals are uncontrolled within zone L1.
2. z is depth of T.
3. Dot lines area designs may vary.
4. Eject pin mark is for reference only.
Outline
version
References
IEC
JEDEC
JEITA
k⁽³⁾
L
L₁₍₁₎
L₂
max
0.6 14.4 3.3
0.5
0.4 13.5 2.8
mPQ
6.5 3.2 2.6
6.3 3.0 2.3
European
projection
SOD113
2-lead TO-220F
q T⁽⁴⁾ w z⁽²⁾
2.6 2.55 0.4 0.8
sod113_po
Issue date
07-06-08
15-08-28
Fig. 8. Package outline TO-220F (SOD113)
BYC8X-600P
Product data sheet
All information provided in this document is subject to legal disclaimers.
3 August 2015
© NXP Semiconductors N.V. 2015. All rights reserved
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