BYC8X-600P_15 Datasheet, PDF (5/11 Pages) NXP Semiconductors – Hyperfast power diode

NXP Semiconductors
BYC8X-600P
Hyperfast power diode
9. Thermal characteristics
Table 6.
Symbol
R_th(j-h)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
heatsink
thermal resistance
from junction to
ambient free air
Conditions
without heatsink compound
with heatsink compound; Fig. 5
10
Z_th(j-h)
(K/W)
1
001aaf257
Min Typ Max Unit
-
-
7.2 K/W
-
-
5.5 K/W
-
60
-
K/W
10^{- 1}
P
δ = ^tp
T
10^{- 2}
10^{- 3}
10^{- 6}
10^{- 5} 10^{- 4}
10^{- 3}
10^{- 2}
t_p
T
10^{- 1}
t
1 10
t_p (s)
Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse width
10. Isolation characteristics
Table 7. Isolation characteristics
Symbol
Parameter
Conditions
V_isol(RMS)
RMS isolation voltage
50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all
pins to external heatsink; sinusoidal
waveform; clean and dust free
C_isol
isolation capacitance from cathode to external heatsink
Min Typ Max Unit
-
-
2500 V
-
10
-
pF
BYC8X-600P
Product data sheet
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3 August 2015
© NXP Semiconductors N.V. 2015. All rights reserved
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